Intermeta相关论文
Research on development of in situ titanium matrix composites and in situ reaction thermodynamics of
The in situ synthesis method for titanium matrix composites (TMCs) has obvious technical and economical advantages over ......
The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile ......
The microstructures and electrochemical properties of LaNi3.8-xAlx (x=0.0,0.1,0.2,0.3 and 0.4) alloys were studied syste......
Oxidation behaviour of electron beam physical vapour deposition β-NiAlHf coatings at 1100℃ in dry an
NiAl intermetallic compounds attract increasing attention for high-temperature applications due to their combination of ......
采用一种固液反应球磨专利技术制备了TiAl,NiAl和FeAl系金属间化合物,所谓固液反应球磨技术是在一定温度区间,球磨介质对金属液体......
对比了充胶和未充胶塑料封装球栅阵列(PBGA)器件在-40 ℃～125 ℃温度循环条件下的热疲劳寿命,采用光学显微镜研究了失效样品焊点的......
根据电磁搅拌时定向凝固形成分离共晶的原理，制备了内表面的Ａｌ３Ｎｉ金属间合物、上表面为少量Ａｌ３Ｎｉ与亚共晶组织，而基体为亚共晶组织的自生表面复......
在Q235钢试样上刷涂A1粉，并应用等离子表面重熔技术在试样上制备Fe3Al金属化合物覆层。用x射线衍射仪分析了覆层的相组成。用金相显......
对1060铝板进行了搅拌摩擦加工（FSP）,通过在加工区添加钛粉的方法原位生成了第二相Al3Ti颗粒,研究了第二相颗粒的分布及焊核区晶粒尺......
Formation of interfacial brittle phases sigma phase and IMC in hybrid titanium-to-stainless steel jo
The microstructures of the brazed joints for commercially pure Ti and stainless steel were investigated by the applicati......
焊球界面层裂是微电子封装器件的主要失效模式之一。针对微电子封装器件的界面层失效问题，首先利用焊球剪切实验，得出在剪切速度增加......
对采用燃烧合成方法制备的Ｎｉ－Ｓｉ金属间化合物材料的组织结构及Ｔｉ对组织结构的影响等作研究，结果表明，少量的Ｔｉ能使铸态组织明显细化，加入较多的......
采用BNi-7＋9％Cu复合钎料对纯Fe进行真空钎焊,研究不同钎焊温度对焊接接头的影响.运用光学显微镜（OM）、扫描电镜（SEM）、能谱分析（EDS）、X射......
论述的制备颗粒增强金属（或金属间化合物）基复合材料的新工艺－ＸＤ合成，并分析了该工艺的未来发展前景。......
